from 750 m below ground to the top of mount everest, smartphones and other portable devices will soon be able to pinpoint their height relative to sea level to better than one meter, using the most recent mems (micro-electromechanical systems) pressure sensors from stmicroelectronics. the new lps331ap is a tiny silicon pressure sensor that provides high-resolution measurements of pressure in an ultra-compact package ideal for use in smartphones, tablet pcs and handheld gps. lps331ap pressure sensor enables 3d indoor positioning and enhanced gps in portable devices key benefits ? able to detect altitude variation in centimeters ? ideal for battery-powered applications ? optional external sw compensation for improved performance* t argeted applications ? indoor and outdoor navigation ? enhanced gps for dead-reckoning ? altimeter and barometer for portable devices ? weather station equipment ? sport watches key features ? 260 to 1260 mbar absolute pressure range ? high-resolution mode: 0.020 mbar rms ? low power consumption: ? low resolution mode: 5.5 a ? high resolution mode: 30 a ? high overpressure capability: 20x full scale ? embedded temperature compensation ? embedded 24-bit adc ? selectable odr from 1 hz to 25 hz ? spi and i 2 c interfaces ? supply voltage: 1.71 to 3.6 v ? high shock survivability: 10,000g www.st.com/mems lps331ap high-resolution mems pressure sensor
a bsolute digital output barometer the lps331ap is an ultra-compact absolute piezoresistive pressure sensor. it includes a monolithic sensing element and an ic interface able to take the information from the sensing element and to provide a digital signal to the external world. the sensing element consists of a suspended membrane inside a single mono- silicon substrate. it is capable of detecting pressure and is manufactured using a specifc proprietary process called vensens. the vensens process allows a mono- silicon membrane to be produced above an air cavity with controlled gap and defned pressure. the membrane is very small compared to traditional silicon micromachined membranes. membrane breakage is prevented by intrinsic mechanical stoppers. the ic interface is manufactured using a standard cmos process. this allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics. the lps331ap is available in a small plastic land grid array (hclga) package and is guaranteed to operate over an extended temperature range from -40 to +85 c. the package is holed to allow external pressure to reach the sensing element. e valuation kit sts pressure sensors are supported by an evaluation kit that consists of a motherboard (steval-mki109v2) and a plug-in module that includes the lps331ap sensor (steval- mki120v1). once the adapter is plugged in, the board can be connected to a host pc via usb so the devices capabilities can be easily evaluated via an intuitive graphic user interface. for further information go to www.st.com/mems. lps331ap block diagram ? stmicroelectronics - september 2012 - printed in united kingdom - all rights reserved the stmicroelectronics corporate logo is a registered trademark of the stmicroelectronics group of companies all other names are the property of their respective owners for more information on st products and solutions, visit www.st.com order code: fllps331ap0912 d evice summary order codes t emperature range (c) p ackage p acking lps331apy -40 to +85 hclga-16l tray lps331aptr tape and reel e valuation boards description steval -mki109v2 motherboard based on stm32. it features a dil24 socket where every st's mems adapter can be plugged in steval -mki120v1 adapter board that enables fast system prototyping and lps331ap evaluation note: *software provided together with the companion chip t e st po i n t s steval-mki109v2 stm32 mi cr o co n t r o l l e r u s b co n n e ct o r lps331ap jt a g / s w d STEVAL-MKI120V1 adapter mux p voltage and current bias clock and timing sensor bias low noise analog front end adc + digital filter dsp for temperature compensation cs scl/spc sda/sdo/sdi sao/sdo i 2 c spi sensing element rs rs rs vout vup vdown rs temperature sensor
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